PART |
Description |
Maker |
BLM21A102SPT BLM11A601SPB BLM31A700SPT BLM41A800SP |
END EMI CHIP BLM21A102SPT 0805 TEMPLATE 1 FUNCTIONS, 0.2 A, FERRITE CHIP FLTR,EMI,,,,200MA,,,,,SM,0603 1 FUNCTIONS, 0.2 A, FERRITE CHIP COIL, BEAD FERRITE 070 OHMS @ 100MHZ B SM, 1206 1 FUNCTIONS, 0.2 A, FERRITE CHIP FERRITE BEAD,CHIP,TYPE 1806, 500 MA 1 FUNCTIONS, 0.5 A, FERRITE CHIP 1 FUNCTIONS, 0.05 A, FERRITE CHIP
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Murata Manufacturing Co., Ltd. MURATA MANUFACTURING CO LTD
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LC662304A LC66E5316 LC66P5316 LC662104A LC662106A |
Four-Bit Single-Chip Microcontroller with 16 KB of On-Chip EPROM Four-Bit Single-Chip Microcontrollers with 4 6 8 12 and 16 KB of On-Chip ROM
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SANYO[Sanyo Semicon Device]
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ISD1100P ISD1100X ISD1112 ISD1110 ISD1120 ISD1110P |
Single-Chip Voice Record/Playback Device(Single-chip Durations of 12 seconds)(单片的录录音重放一片信息存储持续时12秒)) 单芯片语音记播放设备(单芯片的持续时12秒)(单片的录音/录音重放器(一片信息存储持续时12秒) Single-Chip Voice Record/Playback Devices 10- and 12-Second Durations(单片声音录音/回放芯片(单片信息存储持续时间12秒钟)) Single-Chip Voice Record/Playback Device(Single-chip Durations of 10 seconds)(单片的录录音重放一片信息存储持续时0秒)) Single-Chip Voice Record/Playback Device(Single-chip Durations of 12 seconds)(单片的录录音重放一片信息存储持续时2秒)) SINGLE CHIP VOICE RECORD / PLAYBACK DEVICES RES POWER .360 OHM 1W 5% SMT
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List of Unclassifed Manufacturers Winbond Electronics, Corp. Winbond Electronics Corp ETC Electronic Theatre Controls, Inc.
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M38047M6-XXXFP M38047M6-XXXHP M38047M6-XXXSP M3804 |
3803/04 Group: General Purpose, with Flash RAM size: 256bytes; single-chip 8-bit CMOS microcomputer RAM size: 640bytes; single-chip 8-bit CMOS microcomputer RAM size: 896bytes; single-chip 8-bit CMOS microcomputer RAM size: 512bytes; single-chip 8-bit CMOS microcomputer RAM size: 768bytes; single-chip 8-bit CMOS microcomputer RAM size: 384bytes; single-chip 8-bit CMOS microcomputer RAM size: 1024bytes; single-chip 8-bit CMOS microcomputer RAM size: 2048bytes; single-chip 8-bit CMOS microcomputer RAM size: 1536bytes; single-chip 8-bit CMOS microcomputer RAM size: 192bytes; single-chip 8-bit CMOS microcomputer Single Chip 8-bit Microcomputer
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Mitsubishi Electric Corporation
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BK1005HS680 BK1608HS800 BK2125HS101 BK2125HS102 BK |
0.7 A, FERRITE CHIP ROHS COMPLIANT PACKAGE 0.6 A, FERRITE CHIP 0.9 A, FERRITE CHIP 0.3 A, FERRITE CHIP 1 FUNCTIONS, 0.2 A, FERRITE CHIP 1 FUNCTIONS, 0.15 A, FERRITE CHIP
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Taiyo Yuden Co., Ltd. TAIYO YUDEN CO LTD
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CPD06 |
Chip Form: RECTIFIER CHIP General Purpose Rectifier 3 Amp Glass Passivated Rectifier Chip
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Central Semiconductor Corp
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CHF5KP30A CHF5KP50A CHF5KP110CA MSC0997 CHF5KP65A |
Patented Flip Chip Series FLIP CHIP TVS DIODES From old datasheet system Transient Voltage Suppressor 瞬态电压抑制器 5000 W, BIDIRECTIONAL, SILICON, TVS DIODE FLIP CHIP-2
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MICROSEMI[Microsemi Corporation] Atmel, Corp. Microsemi, Corp. Vishay Intertechnology, Inc.
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LC86104C LC86108C |
Liquid Crystal Display Controller/ Driver, On-chip 4K bytes ROM or 8K Bytes ROM and On-chip 168 bytes RAM 8-BIT SINGLE CHIP MICROCOMPUTER LC86104C/LC86108C
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SANYO
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25C320E/P 25C320E/SN 25C320E/ST 25C320E/ST14 25LC3 |
Fuses, 750mA 125V F CHIP 1206 32K的SPI总线串行EEPROM Fuses, 2A 125V F CHIP 1206 32K的SPI总线串行EEPROM SENSOR REFLECTIVE OBJECT 50MA 32K的SPI总线串行EEPROM LED 525NM ROUND GREEN 3MM 32K的SPI总线串行EEPROM 32K SPI Bus Serial EEPROM 32K的SPI总线串行EEPROM Fuses, 4A 125V F CHIP 1206 32K的SPI总线串行EEPROM Fuses, 5A 125V F CHIP 1206 IC Socket Test Clip Connector Type:Plunger Type RoHS Compliant: Yes SENSOR PHOTOLOGIC REFLECTIVE Transformers Only Module Connector Adapter; Convert From:Phone Jack; Convert To:Double Banana Plug; Body Material:Brass; Body Style:Straight RoHS Compliant: Yes Fuses, 375mA 125V F CHIP 1206 Binding Post; Current Rating:3A; Body Material:Phosphor Bronze; Color:Black; Voltage Rating:2500V Fuses, 1.25A 125V F CHIP 1206 Fuses, 1A 125V F CHIP 1206 Fuses, 3.5A 125V F CHIP 1206 Filter Module w/out Resistor Network Fuses, 1.5A 125V F CHIP 1206 Fuses, 2.5A 125V F CHIP 1206
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Microchip Technology, Inc. Microchip Technology Inc.
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PE-0402CD680GTT PE-0402CD190GTT PE-0402CD120GTT PE |
1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.019 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.0087 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.016 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.0012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.011 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.001 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.1 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.02 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.013 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.0018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.023 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.024 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.0033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.0043 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT 1 ELEMENT, 0.0019 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0402, ROHS COMPLIANT
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Pulse Electronics, Corp. PULSE ELECTRONICS CORP
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MPSA12DA MPSA12DB MPSA12DC MPSA42DB MPSA42DC MPSA4 |
TRANSISTOR | BJT | PNP | 150V V(BR)CEO | CHIP 晶体管|晶体管|进步党| 150伏五(巴西)总裁|芯片 TRANSISTOR | BJT | DARLINGTON | NPN | 60V V(BR)CEO | CHIP 晶体管|晶体管|达林顿|叩| 60V的五(巴西)总裁|芯片 TRANSISTOR | BJT | NPN | 140V V(BR)CEO | CHIP 晶体管|晶体管| npn型| 140伏特五(巴西)总裁|芯片 TRANSISTOR | BJT | PNP | 300V V(BR)CEO | CHIP TRANSISTOR | BJT | DARLINGTON | NPN | 30V V(BR)CEO | CHIP TRANSISTOR | BJT | NPN | 300V V(BR)CEO | CHIP TRANSISTOR|BJT|DARLINGTON|NPN|CHIP
TRANSISTOR|BJT|DARLINGTON|NPN|30VV(BR)CEO|CHIP
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Zetex Semiconductor PLC Central Semiconductor, Corp. Cypress Semiconductor, Corp.
|
0907X7R104Z2FB 0907X7R104Z2F4 0907X7R104Z2F5 0907X |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.1 uF, SURFACE MOUNT, 0907 CHIP CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.00082 uF, SURFACE MOUNT, 0704 CHIP CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.0082 uF, SURFACE MOUNT, 1706 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.082 uF, SURFACE MOUNT, 3439 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.00068 uF, SURFACE MOUNT, 0704 CHIP CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.06 uF, SURFACE MOUNT, 2725 CHIP CAPACITOR, CERAMIC, MULTILAYER, 25 V, Y5V, 0.68 uF, SURFACE MOUNT, 1706 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.068 uF, SURFACE MOUNT, 0907 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0068 uF, SURFACE MOUNT, 0704 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.68 uF, SURFACE MOUNT, 2321 CHIP
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Presidio Components, Inc.
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